Title:
RESIN VARNISH, PREPREG, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2019/225482
Kind Code:
A1
Abstract:
Provided is a resin varnish having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature, and low thermal expansion properties, excellent moldability and plating uniformity, and also minimal fluctuation in the amount of dimensional variation. Also provided are a prepreg, a laminate, a printed wiring board, and a semiconductor package obtained using the resin varnish. The resin varnish comprises (A) a maleimide compound, (B) an epoxy resin, and (C) a copolymer resin having structural units derived from an aromatic vinyl compound and structural units derived from maleic anhydride, the maleimide compound (A) being a maleimide compound having an N-substituted maleimide group, obtained by reacting (a1) a maleimide compound having at least two N-substituted maleimide groups, (a2) a monoamine compound, and (a3) a diamine compound, and being obtained by reaction in which the usage ratio [(a2) component/(a3) component] (mole ratio) of the (a2) component to the (a3) component is 0.9-5.0.
Inventors:
SHIRAOKAWA YOSHIKATSU (JP)
GOZU SHUJI (JP)
KUSHIDA KEISUKE (JP)
KANEKO TATSUNORI (JP)
SHIMIZU HIROSHI (JP)
GOZU SHUJI (JP)
KUSHIDA KEISUKE (JP)
KANEKO TATSUNORI (JP)
SHIMIZU HIROSHI (JP)
Application Number:
PCT/JP2019/019565
Publication Date:
November 28, 2019
Filing Date:
May 16, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/42; B32B15/08; C08L25/08; C08L63/00; H05K1/03
Foreign References:
| JP2017115020A | 2017-06-29 | |||
| JP2017019906A | 2017-01-26 | |||
| JP2017210545A | 2017-11-30 | |||
| JP2016210915A | 2016-12-15 | |||
| JP2010235690A | 2010-10-21 | |||
| JP2018165340A | 2018-10-25 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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