Title:
RESIST CURABLE COMPOSITION, PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/098248
Kind Code:
A1
Abstract:
Provided is a resist curable composition with which a cured film of high soldering heat resistance can be obtained and a cured film of high light resistance can be obtained. This resist curable composition contains: a phosphate compound having a lactone-modified (meth)acrylate structure; a titanium oxide; and a photopolymerization initiator.
Inventors:
NISHIMURA TAKASHI (JP)
NAKAMURA SHIGERU (JP)
MAENAKA HIROSHI (JP)
KAGE SHUUJI (JP)
TAKAHASHI TOSHIO (JP)
NAKAMURA SHIGERU (JP)
MAENAKA HIROSHI (JP)
KAGE SHUUJI (JP)
TAKAHASHI TOSHIO (JP)
Application Number:
PCT/JP2018/042186
Publication Date:
May 23, 2019
Filing Date:
November 14, 2018
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H05K3/28; C08F230/02; C08F290/00
Domestic Patent References:
| WO2016002923A1 | 2016-01-07 |
Foreign References:
| JPH0275637A | 1990-03-15 | |||
| JP2006259391A | 2006-09-28 | |||
| JP2007322546A | 2007-12-13 | |||
| JP2017173349A | 2017-09-28 | |||
| JP2016175964A | 2016-10-06 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Download PDF: