Title:
RESIST PATTERN FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/130873
Kind Code:
A1
Abstract:
The purpose of the present invention is to efficiently form a resist pattern using a resist composition that includes a polymer, said resist composition being able to suppress the occurrence of resist pattern collapse when used as a main-chain scission positive resist. This resist pattern forming method is characterized by including: a step in which a resist film is formed using a positive resist composition that includes a polymer, said polymer having a monomer unit (A) expressed by general formula (1) and a monomer unit (B) expressed by general formula (2), at least one of said monomer unit (A) and said monomer unit (B) having one or more fluorine atoms; an exposure step; and a development step, wherein the development is performed using a developing fluid with a surface tension that is greater than 17mN/m and less than or equal to 24mN/m.
Inventors:
HOSHINO MANABU (JP)
Application Number:
PCT/JP2017/002032
Publication Date:
August 03, 2017
Filing Date:
January 20, 2017
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
G03F7/039; C08F212/14; C08F222/18; G03F7/20; G03F7/32; H01L21/027
Foreign References:
JPS57118243A | 1982-07-23 | |||
JPS5949536A | 1984-03-22 | |||
JPH08203929A | 1996-08-09 | |||
JPS53100774A | 1978-09-02 | |||
JP2011215243A | 2011-10-27 | |||
JPH02115852A | 1990-04-27 | |||
JP2013064970A | 2013-04-11 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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