Title:
RESONATOR AND RESONANCE DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/203741
Kind Code:
A1
Abstract:
The present invention enables a second- or higher-order TCF to be reduced in a resonator.
A resonator is provided with: a vibration part having a silicon substrate, one or more electrodes each formed so as to have a surface facing a front surface of the silicon substrate, and a piezoelectric body that is formed between the silicon substrate and the electrode and performs contour vibration in a plane along the front surface of the silicon substrate in response to voltage applied to the electrode; a holding part provided so as to surround at least part of the vibration part; and a holding arm connecting the vibration part and the holding part. The vibration part includes at least one approximately rectangular vibration region having long sides parallel to a node of the contour vibration of the piezoelectric body, and short sides orthogonal to the node of the contour vibration of the piezoelectric body and corresponding to a half wavelength of the contour vibration, and the resonator is set in the range of W/T≥4 and set in the range of y=-0.85×(1/T)+0.57±0.05 where T is the thickness in a direction orthogonal to the front surface of the silicon substrate, W is the width of the short side of the vibration region, and y is the resistivity of the silicon substrate.
Inventors:
NISHIMURA TOSHIO (JP)
Application Number:
PCT/JP2017/000968
Publication Date:
November 30, 2017
Filing Date:
January 13, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/24; B81B3/00; H03H9/02
Domestic Patent References:
| WO2016063863A1 | 2016-04-28 | |||
| WO2016006433A1 | 2016-01-14 | |||
| WO2015108124A1 | 2015-07-23 |
Foreign References:
| JP2009111623A | 2009-05-21 | |||
| JP2014507096A | 2012-03-27 |
Other References:
See also references of EP 3444947A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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