RETAINING RING WITH SHAPED SURFACE

WIPO Patent Application WO2005049274

B1

A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portion. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

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CHEN HUNG CHIH (US)
ZUNIGA STEVEN M (US)
GARRETSON CHARLES C (US)
MCALLISTER DOUGLAS R (US)
MEYER STACY (US)
LIN JIAN (US)
HUEY SIDNEY P (US)
OH JEONGHOON (US)
DOAN TRUNG T (US)
SCHMIDT JEFFREY (US)
WOHLERT MARTIN S (US)
HUGHES KERRY F (US)
WANG JAMES C (US)
LU DANNY CAM TOAN (US)
DELAMENIE ROMAIN BEAU (US)
BALAGANI VENKATA R (US)
ALLEN ADEN MARTIN (US)
FONG MICHAEL JON (US)

PCT/US2004/038083

December 29, 2005

November 12, 2004

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APPLIED MATERIALS INC (US)
CHEN HUNG CHIH (US)
ZUNIGA STEVEN M (US)
GARRETSON CHARLES C (US)
MCALLISTER DOUGLAS R (US)
MEYER STACY (US)
LIN JIAN (US)
HUEY SIDNEY P (US)
OH JEONGHOON (US)
DOAN TRUNG T (US)
SCHMIDT JEFFREY (US)
WOHLERT MARTIN S (US)
HUGHES KERRY F (US)
WANG JAMES C (US)
LU DANNY CAM TOAN (US)
DELAMENIE ROMAIN BEAU (US)
BALAGANI VENKATA R (US)
ALLEN ADEN MARTIN (US)
FONG MICHAEL JON (US)

B24B37/32; (IPC1-7): B24B37/04

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