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Title:
RETICLE PREPARATION METHOD, RETICLE, JOSEPHSON JUNCTION ELEMENT, AND QUANTUM CHIP
Document Type and Number:
WIPO Patent Application WO/2023/016270
Kind Code:
A1
Abstract:
A reticle preparation method, a reticle, a Josephson junction element, and a quantum chip, relating to the field of quantum information, and in particular to the technical field of quantum computing. The reticle preparation method comprises: providing a dielectric layer, the ratio of the thickness of the dielectric layer to the line width of a target pattern to be prepared being greater than a cutting aspect ratio allowed by a patterning device; determining a first sub-layer and a second sub-layer of the dielectric layer, the ratio of the thickness of the second sub-layer to the line width of the target pattern being less than or equal to the cutting aspect ratio; and forming the target pattern on the second sub-layer and a first pattern on the first sub-layer, the first pattern exposing the target pattern. In the present application, a reticle containing the target pattern can be prepared when the ratio of the thickness of the provided dielectric layer to the line width of the target pattern to be prepared is greater than the cutting aspect ratio allowed by the patterning device.

Inventors:
ZHAO YONGJIE (CN)
YANG HUI (CN)
DAI ZHIPENG (CN)
MA LIANGLIANG (CN)
YOU BING (CN)
WANG NIANCI (CN)
LU RUI (CN)
Application Number:
PCT/CN2022/108618
Publication Date:
February 16, 2023
Filing Date:
July 28, 2022
Export Citation:
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Assignee:
ORIGIN QUANTUM COMPUTING TECH CO LTD (CN)
International Classes:
G03F1/20
Foreign References:
CN215731778U2022-02-01
JPH10270353A1998-10-09
JP2005286276A2005-10-13
CN110223956A2019-09-10
JPH08236748A1996-09-13
Attorney, Agent or Firm:
PATENTSINO IP FIRM (CN)
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