Title:
RFID LABEL AND ADHEREND
Document Type and Number:
WIPO Patent Application WO/2022/138019
Kind Code:
A1
Abstract:
An RFID inlay, a hot melt adhesive layer stacked on a surface on which an RFID antenna and an IC chip of the RFID inlay are formed, a first thermoplastic resin sheet, and an adhesive layer for an adherend to be affixed to the adherend are stacked in this order.
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Inventors:
NITTA HARUHIKO (JP)
Application Number:
PCT/JP2021/043962
Publication Date:
June 30, 2022
Filing Date:
November 30, 2021
Export Citation:
Assignee:
SATO HOLDINGS KK (JP)
International Classes:
G09F3/00; G06K19/077; G09F3/10
Foreign References:
| JP2008234245A | 2008-10-02 | |||
| JP2001134731A | 2001-05-18 | |||
| JPH1173109A | 1999-03-16 | |||
| JP2020215297A |
Other References:
See also references of EP 4270366A1
Attorney, Agent or Firm:
GOTOH & PARTNERS (JP)
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