Title:
ROBOT ARM FOR TRANSPORTING SEMICONDUCTOR SUBSTRATES
Document Type and Number:
WIPO Patent Application WO/2017/084079
Kind Code:
A1
Abstract:
A robot arm (300, 400, 500, 600) for transporting semiconductor substrates (304, 404) comprises a body portion (301, 401, 501, 601), an end portion (302, 402, 502, 602) extending from the body portion (301, 401, 501, 601), a plurality of vacuum cups disposed on the end portion (302, 402, 502, 602), and a plurality of vacuum lines connecting to the plurality of vacuum cups respectively. The distance between any two adjacent vacuum cups satisfies the following condition: a vertical displacement of the semiconductor substrate (304, 404) produced by one of the two adjacent vacuum cups sucking down the semiconductor substrate is greater than a warpage of the semiconductor substrate (304, 404) in the range of the two adjacent vacuum cups, so that once the one of the two adjacent vacuum cups sucks the semiconductor substrate (304, 404), the other vacuum cup of the two adjacent vacuum cups is followed to suck the semiconductor substrate (304, 404).
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Inventors:
WANG HUI (CN)
WU JUN (CN)
FANG ZHIYOU (CN)
WU JUN (CN)
FANG ZHIYOU (CN)
Application Number:
PCT/CN2015/095089
Publication Date:
May 26, 2017
Filing Date:
November 20, 2015
Export Citation:
Assignee:
ACM RES (SHANGHAI) INC (CN)
International Classes:
H01L21/677; H01L21/683
Domestic Patent References:
| WO2012004002A1 | 2012-01-12 |
Foreign References:
| US20150146187A1 | 2015-05-28 | |||
| US20140169929A1 | 2014-06-19 | |||
| US20100201976A1 | 2010-08-12 | |||
| KR20110101808A | 2011-09-16 | |||
| US20140227072A1 | 2014-08-14 | |||
| CN101295661A | 2008-10-29 | |||
| KR20100077523A | 2010-07-08 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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