Title:
ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE BOARD, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/255422
Kind Code:
A1
Abstract:
Provided is a roughened copper foil which, when used in a copper-clad laminate board or a printed circuit board, is capable of attaining both excellent transmission properties and high peel strength. This roughened copper foil has a roughened surface on at least one side thereof, wherein the proportion of the sum of the frequency components at a frequency of 1 to 5, inclusive, constitutes at least 15.0% of the sum of the frequency components at a frequency of 1 to 511, inclusive, and the average value of the frequency components at a frequency of 13 to 511, inclusive, equals 0.010μm or less, when a cross-sectional curve having a target length of 64μm in the horizontal direction on the roughened surface is broken down into 512 frequency components by a Fourier transform at a frequency interval of 1 and a frequency range of 0 to 511, inclusive.
Inventors:
KATO TSUBASA (TW)
TATEOKA AYUMU (TW)
YANG PO CHUN (TW)
KAWAGUCHI SHOTA (JP)
TATEOKA AYUMU (TW)
YANG PO CHUN (TW)
KAWAGUCHI SHOTA (JP)
Application Number:
PCT/JP2022/022388
Publication Date:
December 08, 2022
Filing Date:
June 01, 2022
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
C25D7/06; B32B15/04; B32B15/08; B32B15/20; C23C26/00; C23C28/00; C25D1/04; C25D5/16; C25D7/00; H05K1/03; H05K1/09
Domestic Patent References:
| WO2018110579A1 | 2018-06-21 |
Foreign References:
| CN113099605A | 2021-07-09 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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