Title:
ROUGHENED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/255421
Kind Code:
A1
Abstract:
Provided is a roughened copper foil having excellent transmission characteristics and circuit linearity and capable of achieving high peel strength when used in a copper clad laminate or a printed wiring board. This roughened copper foil has a roughened surface on at least one side. The roughened surface has a value Rdc/Rku, which is the ratio of the cut level difference Rdc of the roughness curve to the kurtosis Rku of the roughness curve, of 0.180 μm or less, and has a value of the maximum cross-sectional height Wt of the undulation curve of 2.50 μm or more and 10.00 μm or less. Rku and Wt are values measured in accordance with JIS B0601-2013, and Rdc is a value obtained as the difference in cut level c in the height direction between a load length ratio of 20% and a load length ratio of 80% in accordance with JIS B0601-2013.
Inventors:
KATO TSUBASA (TW)
TATEOKA AYUMU (TW)
YANG PO CHUN (TW)
KAWAGUCHI SHOTA (JP)
TATEOKA AYUMU (TW)
YANG PO CHUN (TW)
KAWAGUCHI SHOTA (JP)
Application Number:
PCT/JP2022/022387
Publication Date:
December 08, 2022
Filing Date:
June 01, 2022
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
C25D7/06; B32B15/04; B32B15/20; C23C26/00; C25D1/04; C25D5/16; H05K1/03; H05K1/09
Domestic Patent References:
| WO2019188087A1 | 2019-10-03 | |||
| WO2014042201A1 | 2014-03-20 |
Foreign References:
| JP2014201777A | 2014-10-27 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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