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Title:
ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/255420
Kind Code:
A1
Abstract:
Provided is a roughened copper foil simultaneously achieving excellent transmission characteristics and high peel strength when used in a copper-clad laminated board or a printed wiring board. This roughened copper foil has a roughened surface on at least one side. The microparticle tip volume of the roughened surface is 1.300 μm3/particle or less, as calculated by the formula (Vmp + Vmc)/Spd, where Vmp is the material volume of a protruding peak portion, Vmc is the material volume of a core portion, and Spd is the density of peaks, and the cut level difference Rdc is 0.95 μm or greater. Vmp, Vmc and Spd are values measured in compliance with ISO 25178, and Rdc is a value obtained as the difference in the cut level c in the height direction at load length ratios of 20% and 80% in compliance with JIS B0601-2013.

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Inventors:
KATO TSUBASA (TW)
TATEOKA AYUMU (TW)
YANG PO CHUN (TW)
KAWAGUCHI SHOTA (JP)
Application Number:
PCT/JP2022/022386
Publication Date:
December 08, 2022
Filing Date:
June 01, 2022
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
C25D7/06; B32B15/20; C23C26/00; C25D5/16; H05K1/03
Domestic Patent References:
WO2020105289A12020-05-28
WO2017179416A12017-10-19
Foreign References:
JP2020128589A2020-08-27
JP2020122189A2020-08-13
JP2020122190A2020-08-13
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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