Title:
ROUGHENED COPPER FOIL, COPPER FOIL WITH CARRIER, COPPER-CLADDED LAMINATE BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/244826
Kind Code:
A1
Abstract:
Provided is a roughened copper foil capable of realizing both excellent transmission properties and high shear strength, in the processing of a copper-clad laminate or the production of a printed wiring board. This roughened copper foil has a roughened surface on at least one side thereof. This roughened surface has a plurality of peaks, which protrude with respect to a reference plane, and a plurality of valleys, which are recessed with respect to the reference plane. When an image of the roughened surface obtained using FIB-SEM was subjected to three-dimensional image analysis, the sum total of the peak and valley heights calculated as the sum of the peak volume and the valley volume in a 2000 nm × 2000 nm analysis area is 1.4 × 108 nm3 to 3.5 × 108 nm3, and the average height of the peaks and valleys calculated as the sum of the average peak height and the average valley height is 40 nm to 90 nm.
Inventors:
KOIDE SAORI (JP)
HOSOKAWA MAKOTO (JP)
KURIHARA MIHO (JP)
TASAKA CHISATO (JP)
YOTSUI AYAKO (JP)
MIZOGUCHI MISATO (JP)
HOSOKAWA MAKOTO (JP)
KURIHARA MIHO (JP)
TASAKA CHISATO (JP)
YOTSUI AYAKO (JP)
MIZOGUCHI MISATO (JP)
Application Number:
PCT/JP2022/020747
Publication Date:
November 24, 2022
Filing Date:
May 18, 2022
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
C25D7/06; C25D1/04; C25D5/16; H05K3/38; H05K3/46
Domestic Patent References:
| WO2017099094A1 | 2017-06-15 | |||
| WO2018211951A1 | 2018-11-22 | |||
| WO2019093494A1 | 2019-05-16 |
Foreign References:
| JP2020143362A | 2020-09-10 | |||
| JP2016089192A | 2016-05-23 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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