Title:
ROUGHENED COPPER FOIL, COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/244827
Kind Code:
A1
Abstract:
Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and high shear strength in processing of a copper-clad laminate or manufacturing of a printed wiring board. This roughened copper foil has a roughened surface on at least one side thereof. The roughened surface has a plurality of peaks that protrude with respect to a reference plane and a plurality of valleys that are recessed with respect to the reference plane. When three-dimensional image analysis is performed on an image obtained by employing FIB-SEM on the roughened surface and the peaks are divided into a plurality of voxels, the surface voxel ratio, which is the ratio of the total volume of voxels constituting the surfaces of the peaks to the total volume of all voxels constituting the peaks in an analysis area of 2000 nm × 2000 nm, is 0.25 to 0.60, and the average height of the peaks and the valleys, which is calculated as the sum of the average height of the peaks and the average height of the valleys in the analysis area of 2000 nm × 2000 nm, is 40 nm to 90 nm.
Inventors:
KOIDE SAORI (JP)
HOSOKAWA MAKOTO (JP)
KURIHARA MIHO (JP)
TASAKA CHISATO (JP)
YOTSUI AYAKO (JP)
MIZOGUCHI MISATO (JP)
HOSOKAWA MAKOTO (JP)
KURIHARA MIHO (JP)
TASAKA CHISATO (JP)
YOTSUI AYAKO (JP)
MIZOGUCHI MISATO (JP)
Application Number:
PCT/JP2022/020748
Publication Date:
November 24, 2022
Filing Date:
May 18, 2022
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
C25D7/06; C25D1/04; C25D5/16; H05K3/38; H05K3/46
Domestic Patent References:
| WO2017099094A1 | 2017-06-15 | |||
| WO2018211951A1 | 2018-11-22 | |||
| WO2019093494A1 | 2019-05-16 |
Foreign References:
| JP2016089192A | 2016-05-23 | |||
| JP2020143362A | 2020-09-10 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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