Title:
ROUGHENED COPPER FOIL, COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/244828
Kind Code:
A1
Abstract:
Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and a high shear strength in the processing of a copper-clad laminate or in the production of a printed wiring board. This roughened copper foil has a roughened surface on at least one side. This roughened surface has multiple roughening particles, including spherical particles, wherein when a three-dimensional image analysis of a roughened surface image obtained using an FIB-SEM is carried out, the roughening particles have an average height of 70 nm or less, and the occupancy ratio of the spherical particles in the multiple roughening particles is 30% or greater. When a long axis, intermediate axis, and short axis that are orthogonal to each other are set for the of the roughening particles and the length L of the long axis is expressed by 1.0, the spherical particles satisfy the following: the length M of the intermediate axis satisfies 0.3 ≤ M ≤ 1.0, and the length S of the short axis satisfies 0.3 ≤ S ≤ 1.0.
Inventors:
KOIDE HIYAMA SAORI (JP)
HOSOKAWA MAKOTO (JP)
KURIHARA NAKAGAWA MIHO (JP)
TASAKA CHISATO (JP)
YOTSUI AYAKO (JP)
MIZOGUCHI TASHIRO MISATO (JP)
HOSOKAWA MAKOTO (JP)
KURIHARA NAKAGAWA MIHO (JP)
TASAKA CHISATO (JP)
YOTSUI AYAKO (JP)
MIZOGUCHI TASHIRO MISATO (JP)
Application Number:
PCT/JP2022/020749
Publication Date:
November 24, 2022
Filing Date:
May 18, 2022
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
C25D7/06; C25D1/04; C25D5/16; H05K3/38; H05K3/46
Domestic Patent References:
| WO2018211951A1 | 2018-11-22 | |||
| WO2017099094A1 | 2017-06-15 |
Foreign References:
| JP2016089192A | 2016-05-23 | |||
| JP2014152352A | 2014-08-25 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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