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Title:
SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/262654
Kind Code:
A1
Abstract:
A sealing resin composition according to the present invention contains an epoxy resin and a curing agent including an active ester compound, the equivalent ratio of the active ester compound to the epoxy resin (active ester compound/epoxy resin) being 0.9 or less.

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Inventors:
SAITO TAKAHIRO (JP)
YAMAURA MASASHI (JP)
KASUGA KEIICHI (JP)
Application Number:
PCT/JP2020/025356
Publication Date:
December 30, 2020
Filing Date:
June 26, 2020
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08G59/40; H01L21/56; H01L23/29; H01L23/31
Foreign References:
JP2012246367A2012-12-13
JP2015106698A2015-06-08
JP2010111859A2010-05-20
JP2019006895A2019-01-17
JP2018100421A2018-06-28
JP2012246497A2012-12-13
JP2018172519A2018-11-08
JP2016079384A2016-05-16
JPH11349666A1999-12-21
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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