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Patent Searching and Data


Title:
SEALING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/249987
Kind Code:
A1
Abstract:
This sealing resin composition includes an epoxy resin, a curing agent, an inorganic filler, and rubber particles, wherein a cured product of the sealing resin composition has a toughness index at 25 °C of 80 to 100.

Inventors:
YAMAMOTO JUN (JP)
Application Number:
PCT/JP2022/020956
Publication Date:
December 01, 2022
Filing Date:
May 20, 2022
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
H01L23/29; C08K3/013; C08L21/00; C08L63/00; H01L23/31
Foreign References:
JPH1060085A1998-03-03
JP2011057734A2011-03-24
JP2018002923A2018-01-11
JP2004018803A2004-01-22
JP2005264037A2005-09-29
JP2021089965A2021-06-10
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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