Title:
SEALING SHEET
Document Type and Number:
WIPO Patent Application WO/2020/251028
Kind Code:
A1
Abstract:
The present invention provides a sealing sheet having a thermosetting sealant layer, the sealing sheet being characterized by satisfying a requirement (I), a requirement (II), and a requirement (III). A sealing sheet according to the present invention has a sealant layer that has a superior stickability at a normal temperature and that does not easily deform in a thermosetting process. Requirement (I): the sealant layer contains one or more types of epoxy compounds. Requirement (II): the storage modulus of the sealant layer at 23ºC is equal to or less than 3.0×107 Pa. Requirement (III): when the sealant layer is heated at a rate of 25ºC/min staring from 35ºC until reaching 110ºC and is subsequently maintained at 110ºC, the complex viscosity of the sealant layer is equal to or greater than 1×104 Pa•s at 250 seconds after starting the heating.
Inventors:
NISHIJIMA KENTA (JP)
HASEGAWA TATSUKI (JP)
HASEGAWA TATSUKI (JP)
Application Number:
PCT/JP2020/023240
Publication Date:
December 17, 2020
Filing Date:
June 12, 2020
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09K3/10
Domestic Patent References:
| WO2018047919A1 | 2018-03-15 | |||
| WO2013080708A1 | 2013-06-06 |
Foreign References:
| JP2013175603A | 2013-09-05 | |||
| JP2015042754A | 2015-03-05 | |||
| JP2013115211A | 2013-06-10 | |||
| JP2015189802A | 2015-11-02 |
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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