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Patent Searching and Data


Title:
SEAMLESS PRODUCT MANUFACTURING METHOD AND SEAMLESS PRODUCT MANUFACTURING JIG
Document Type and Number:
WIPO Patent Application WO/2023/190359
Kind Code:
A1
Abstract:
Provided are a seamless product manufacturing method and a seamless product manufacturing jig with which it is possible to reduce defects at adhesion locations on ends of a fabric and to improve productivity. This seamless product manufacturing method includes: a fabric installation step for disposing, on an installation surface for the fabric, a high friction body set to have a greater coefficient of friction than the installation surface, followed by superimposing ends of the fabric on the high friction body, and installing the fabric on the installation surface; an adhesive layer forming step for forming an adhesive layer on the fabric; and a fabric folding step for turning over the high friction body on the installation surface, folding the ends of the fabric superimposed on the high friction body, and superimposing the folded ends on the adhesive layer.

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Inventors:
YAMATO RYOSUKE (JP)
SAITO KOICHI (JP)
KOMIYA SOUICHIROU (JP)
Application Number:
PCT/JP2023/012232
Publication Date:
October 05, 2023
Filing Date:
March 27, 2023
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
A41H43/04
Foreign References:
JP2014030568A2014-02-20
JP2000170005A2000-06-20
JP2016204813A2016-12-08
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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