Title:
SEMI-AROMATIC POLYAMIDE RESIN AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2017/077901
Kind Code:
A1
Abstract:
Provided is a semi-aromatic polyamide resin which has excellent heat resistance and melt fluidity, and further has excellent thermal discoloration resistance, and is suitable for a resin composition for molded articles such as automobile parts, electrical/electronic parts, and the like. The semi-aromatic polyamide resin contains 50 mol% or more of a constituent unit obtained from an equimolar salt of a diamine having 2-12 carbon atoms and terephthalic acid, and satisfies requirements (a)-(d): (a) the melting point (Tm) is 290-350°C; (b) the initial relative viscosity (RV0) is 1.3-2.1, and the ratio (MFR/RV5) of the numerical value of the melt flow rate (MFR) to the numerical value of the relative viscosity (RV5) obtained after the melt is retained at a temperature 20°C above the melting point for 5 minutes is 50 or more; (c) the terminal amino group concentration (AEG) is 15 eq/ton or less, and the ratio (AEG/CEG) of AEG to the terminal carboxyl group concentration (CEG) is 0.07 or less; and (d) the ratio (RV5/RV0) of the relative viscosity (RV5) to the relative viscosity (RV0) is 0.900-1.010.
Inventors:
TAMATSUSHIMA MAKOTO (JP)
NAKAO JUNICHI (JP)
FUKUDA HIROKI (JP)
NAKAO JUNICHI (JP)
FUKUDA HIROKI (JP)
Application Number:
PCT/JP2016/081514
Publication Date:
May 11, 2017
Filing Date:
October 25, 2016
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08G69/02; C08G69/04
Domestic Patent References:
| WO2011052464A1 | 2011-05-05 | |||
| WO2012098840A1 | 2012-07-26 | |||
| WO2015029780A1 | 2015-03-05 |
Foreign References:
| JPH07228689A | 1995-08-29 | |||
| JPH1192657A | 1999-04-06 |
Attorney, Agent or Firm:
KAZAHAYA, Nobuaki et al. (JP)
Download PDF:
Previous Patent: SCREEN PLATE FOR SCREEN PRINTING
Next Patent: DATA PROCESSING DEVICE, DATA PROCESSING METHOD, AND PROGRAM
Next Patent: DATA PROCESSING DEVICE, DATA PROCESSING METHOD, AND PROGRAM