Title:
SEMICONDUCTOR COMPONENT COMPRISING AN INTERPOSER SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO2005081316
Kind Code:
A3
Abstract:
The invention relates to a semiconductor component (10) comprising an interposer substrate (1) and provided in the form of a stack element of a semiconductor component stack (25). The interposer substrate (1) comprises, on one of the interposer substrate sides (2, 4), a semiconductor chip that is protected in its lateral edges (22) by a plastic compound (12). An interposer structure (3) is placed on the interposer side (2, 4) opposite the semiconductor chip (6) and is partially covered by a plastic compound (12). Edge areas (11) of the interposer substrate (1) remain free from any plastic compound (12) and have, on both interposer sides (2, 4), outer lands (7) which are connected to one another by via holes (8).
Inventors:
HETZEL WOLFGANG (DE)
THOMAS JOCHEN (DE)
WEITZ PETER (DE)
WENNEMUTH INGO (DE)
THOMAS JOCHEN (DE)
WEITZ PETER (DE)
WENNEMUTH INGO (DE)
Application Number:
PCT/DE2005/000302
Publication Date:
January 12, 2006
Filing Date:
February 22, 2005
Export Citation:
Assignee:
INFINEON TECHNOLOGIES AG (DE)
HETZEL WOLFGANG (DE)
THOMAS JOCHEN (DE)
WEITZ PETER (DE)
WENNEMUTH INGO (DE)
HETZEL WOLFGANG (DE)
THOMAS JOCHEN (DE)
WEITZ PETER (DE)
WENNEMUTH INGO (DE)
International Classes:
H01L23/31; H01L25/065; H01L25/10; (IPC1-7): H01L25/065
Foreign References:
| US6331939B1 | 2001-12-18 | |||
| US20030042564A1 | 2003-03-06 | |||
| US20030006496A1 | 2003-01-09 |
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