Title:
SEMICONDUCTOR COMPONENT COMPRISING A STACK OF SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO2005081315
Kind Code:
A3
Abstract:
The invention relates to a semiconductor component (14) comprising a stack (100) of semiconductor chips (1, 2), these semiconductor chips (1, 2) being fixed to one another with material fit. The contact surfaces (5) of the semiconductor chips (1, 2) lead up to the edges (6) of the semiconductor chip (1, 2), and conductor sections (7) extend at least from a top edge (8) to a bottom edge (9) of the edge sides (10) of the semiconductor chips (1, 2) in order to electrically connect the contact surface (5) of the stacked semiconductor chips (1, 2) to one another.
Inventors:
BAUER MICHAEL (DE)
ENGLING THOMAS (DE)
HAIMERL ALFRED (DE)
KESSLER ANGELA (DE)
MAHLER JOACHIM (DE)
SCHOBER WOLFGANG (DE)
ENGLING THOMAS (DE)
HAIMERL ALFRED (DE)
KESSLER ANGELA (DE)
MAHLER JOACHIM (DE)
SCHOBER WOLFGANG (DE)
Application Number:
PCT/DE2005/000215
Publication Date:
December 15, 2005
Filing Date:
February 09, 2005
Export Citation:
Assignee:
INFINEON TECHNOLOGIES AG (DE)
BAUER MICHAEL (DE)
ENGLING THOMAS (DE)
HAIMERL ALFRED (DE)
KESSLER ANGELA (DE)
MAHLER JOACHIM (DE)
SCHOBER WOLFGANG (DE)
BAUER MICHAEL (DE)
ENGLING THOMAS (DE)
HAIMERL ALFRED (DE)
KESSLER ANGELA (DE)
MAHLER JOACHIM (DE)
SCHOBER WOLFGANG (DE)
International Classes:
H01L25/065; (IPC1-7): H01L25/065
Domestic Patent References:
| WO2003084297A1 | 2003-10-09 |
Foreign References:
| US20030218191A1 | 2003-11-27 | |||
| US20030132527A1 | 2003-07-17 | |||
| US20030071341A1 | 2003-04-17 | |||
| US20030006493A1 | 2003-01-09 | |||
| US5637536A | 1997-06-10 | |||
| US20030175411A1 | 2003-09-18 | |||
| US20040155326A1 | 2004-08-12 |
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