SEMICONDUCTOR DEVICE AND BONDING METHOD

Title:

SEMICONDUCTOR DEVICE AND BONDING METHOD

Document Type and Number:

WIPO Patent Application WO/2024/047959

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a semiconductor device having low electrical resistance while preventing defects in semiconductor elements caused by thermal expansion differences by laminating an Fe-Ni alloy metal layer directly or indirectly on the front electrode or back electrode of a semiconductor element. An Fe-Ni alloy metal layer 5 is deposited directly or indirectly on the front electrode and/or the back electrode of the semiconductor chip 2, and the semiconductor chip and a conductor 4 are connected through the Fe-Ni alloy metal layer 5. If necessary, the amount of Ni in the Fe-Ni alloy metal layer 5 is in the range of 36-45 wt%, and the thickness of the Fe-Ni alloy metal layer 5 is 2-20 μm.

More Like This:

JP2006156753	TAPE FOR WORKING WAFER
JP2006269992	IMAGE DATA FORMING METHOD AND COMPONENTS MOUNTING APPARATUS USING IT
JP4984573	Semiconductor device manufactured using Diatouch paste and Diatouch paste

Inventors:

TATSUMI KOHEI (JP)
KOSHIBA KEIKO (JP)

Application Number:

PCT/JP2023/018085

Publication Date:

March 07, 2024

Filing Date:

May 15, 2023

Export Citation:

Click for automatic bibliography generation Help

Assignee:

UNIV WASEDA (JP)

International Classes:

H01L21/52; H01L21/60; H01L23/12; H01L23/48

Foreign References:

JP2006179735A	2006-07-06
JP2010225852A	2010-10-07
US20120248176A1	2012-10-04
JP2002305213A	2002-10-18
JPH02275657A	1990-11-09
JPS61268032A	1986-11-27
JP2017005037A	2017-01-05
JP2011198796A	2011-10-06

Attorney, Agent or Firm:

HIRAI Yasuo (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: MACHINE LEARNING DEVICE, MACHINE LEARNING METHOD, AND MACHINE LEARNING PROGRAM

Next Patent: RADIATION-MEASURING INSTRUMENT SUPPORT DEVICE, RADIATION MEASUREMENT DEVICE AND RADIATION MEASUREMEN...