Title:
SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2024/038757
Kind Code:
A1
Abstract:
The present disclosure pertains to a semiconductor device and electronic equipment which make it possible to provide a semiconductor device that allows manufacturing cost to be reduced. The semiconductor device is configured by laminating a first semiconductor, a second semiconductor, and a third semiconductor in the vertical direction. The second semiconductor, which is positioned between the first semiconductor and the third semiconductor, includes a conversion circuit that converts electrical characteristics or physical characteristics. The present disclosure can be applied to, for example, a solid-state imaging device or the like.
Inventors:
SUGIMORI YUSAKU (JP)
Application Number:
PCT/JP2023/028064
Publication Date:
February 22, 2024
Filing Date:
August 01, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N25/70
Domestic Patent References:
| WO2018173764A1 | 2018-09-27 |
Foreign References:
| JP2020072410A | 2020-05-07 | |||
| JP2022074493A | 2022-05-18 | |||
| JP2015126043A | 2015-07-06 | |||
| JP2018181988A | 2018-11-15 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
Download PDF: