Title:
SEMICONDUCTOR DEVICE AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/168514
Kind Code:
A1
Abstract:
The present invention pertains to a semiconductor device and an imaging device that make it possible to realize a configuration that does not hinder miniaturization even when a plurality of terminals that include terminals having a potential difference are arranged. The present invention is provided with a chip, a wiring substrate, and a wire connecting the chip and the wiring substrate, a first opening and a second opening to which the wire is connected being formed on at least one side of the wiring substrate that is a surface on which an insulating film is formed. A first terminal formed in the first opening and a second terminal formed in the second opening are set apart by a prescribed distance in the openings. The present invention can be applied, for example, to an imaging device in which a wiring substrate and a chip are connected by a bonding wire.
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Inventors:
HAMAGUCHI SHINGO (JP)
ANDOU TAKESHI (JP)
ANDOU TAKESHI (JP)
Application Number:
PCT/JP2022/000076
Publication Date:
August 11, 2022
Filing Date:
January 05, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/02; H01L21/60; H01L23/12; H01L27/146; H04N5/369
Foreign References:
| JPH03220755A | 1991-09-27 | |||
| JP2010027856A | 2010-02-04 | |||
| JP2015023159A | 2015-02-02 | |||
| JP2007501537A | 2007-01-25 | |||
| JP2011155184A | 2011-08-11 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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