Title:
SEMICONDUCTOR DEVICE AND LASER MARKING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/139813
Kind Code:
A1
Abstract:
A chip-size-package type semiconductor device (1) that can be mounted face-down has: a semiconductor substrate (11); and a metal layer (20) that is formed on the semiconductor substrate (11) and that is exposed outside. At least one mark is formed on the exposed surface of the metal layer (20). The mark includes an outline section (22b) forming an outline for a laser beam and a center section (22a) located inwards of the outline section (22b). In plan view of the exposed surface of the metal layer (20), the color of the outline section (22b) differs from the color of a base material section (22c), which is the portion of the exposed surface of the metal layer (20) on which the mark is not formed, or the color of the center section (22a).
Inventors:
MASUZAWA KOSUKE
YOSHIDA HIROSHI
YOSHIDA HIROSHI
Application Number:
PCT/JP2022/026880
Publication Date:
July 27, 2023
Filing Date:
July 06, 2022
Export Citation:
Assignee:
NUVOTON TECH CORPORATION JAPAN (JP)
International Classes:
H01L21/02; H01L21/336; H01L21/60; H01L29/78
Domestic Patent References:
| WO2019244383A1 | 2019-12-26 |
Foreign References:
| JP2016139642A | 2016-08-04 | |||
| JP2000223382A | 2000-08-11 | |||
| JP2008012567A | 2008-01-24 |
Attorney, Agent or Firm:
NII, Hiromori et al. (JP)
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