Title:
RESIN COMPOSITION, FILM, CURED MEMBRANE, SEMICONDUCTOR DEVICE, AND MULTILAYER CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/139814
Kind Code:
A1
Abstract:
The present invention enables patterning to be performed without generating residues during development and provides a high elastic modulus and a low linear expansion coefficient. This resin composition contains a high molecular weight compound (A), a cation-polymerizable compound (B), a cationic polymerization initiator (C), and a metal oxide (D), and is characterized in that the high molecular weight compound (A) has, at a terminal of the molecule chain thereof, a structure derived from a carboxylate residue, and is at least one compound selected from the group consisting of polyamides, polyimides, and polyamide-imides.
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Inventors:
KATO KEIGO (JP)
MATSUMURA KAZUYUKI (JP)
TATEOKA YOSHIKO (JP)
SHIMADA AKIRA (JP)
MATSUMURA KAZUYUKI (JP)
TATEOKA YOSHIKO (JP)
SHIMADA AKIRA (JP)
Application Number:
PCT/JP2022/026936
Publication Date:
July 27, 2023
Filing Date:
July 07, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G59/32; C08K3/22; C08L63/00; C08L77/00; C08L79/08; G03F7/004; G03F7/038; G03F7/075; H05K1/03; H05K3/46
Domestic Patent References:
| WO2021059843A1 | 2021-04-01 | |||
| WO2017169574A1 | 2017-10-05 |
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