Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/255252
Kind Code:
A1
Abstract:
The semiconductor device comprises a base substrate (UK), a first light-reflecting portion (RF) positioned above the base substrate (UK), a first mask (6) positioned above the first light-reflecting portion (RF), a base semiconductor portion (8) positioned above the first mask (6), a compound semiconductor portion (9) positioned above the base semiconductor portion (8), and a second light-reflecting portion (RS) positioned above the compound semiconductor portion (9) and the first light-reflecting portion (RF).
Inventors:
KAMIKAWA TAKESHI (JP)
KAWAGUCHI YOSHINOBU (JP)
TANIGUCHI YUKI (JP)
KAWAGUCHI YOSHINOBU (JP)
TANIGUCHI YUKI (JP)
Application Number:
PCT/JP2022/021754
Publication Date:
December 08, 2022
Filing Date:
May 27, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01S5/183; H01L21/20; H01L21/205
Foreign References:
| JPH11163402A | 1999-06-18 | |||
| JP2002009004A | 2002-01-11 | |||
| JP2009246291A | 2009-10-22 | |||
| JP2018125404A | 2018-08-09 | |||
| JP2008060459A | 2008-03-13 | |||
| JP2011044447A | 2011-03-03 | |||
| JP2015035540A | 2015-02-19 | |||
| US6875544B1 | 2005-04-05 | |||
| JP6555260B2 | 2019-08-07 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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