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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2018/212625
Kind Code:
A1
Abstract:
Disclosed in an embodiment is a semiconductor device comprising: a semiconductor structure comprising a first conductive semiconductor layer, a second conductive semiconductor layer, an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and a plurality of recesses penetrating the second conductive semiconductor layer and the active layer so as to be disposed up to a part of a region of the first conductive semiconductor layer; a first electrode disposed inside the plurality of recesses so as to be electrically connected to the first conductive semiconductor layer; a second electrode electrically connected to the second conductive semiconductor layer; and a light absorbing layer disposed at the edge of the semiconductor structure, wherein the light absorbing layer and the second electrode are disposed on the lower surface of the semiconductor structure, and the light absorbing layer is thicker than the second electrode.

Inventors:
SUNG YOUN JOON (KR)
KIM MIN SUNG (KR)
KIM HYUN JU (KR)
Application Number:
PCT/KR2018/005734
Publication Date:
November 22, 2018
Filing Date:
May 18, 2018
Export Citation:
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Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L33/02; H01L33/06; H01L33/14; H01L33/22; H01L33/36; H01L33/38; H01L33/62
Foreign References:
KR20170024534A2017-03-07
KR100999798B12010-12-08
JP2013122978A2013-06-20
US20100155693A12010-06-24
EP2355188A22011-08-10
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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