Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/202487
Kind Code:
A1
Abstract:
Provided are: a semiconductor device configured to be able to suppress a temperature increase of a semiconductor element and to suppress warping; a semiconductor device manufacturing method comprising a cooling medium enclosing step; and an electronic apparatus including the semiconductor device. The semiconductor device comprises a semiconductor element, a substrate to which the semiconductor element is adhered, and a cooling medium filled in a gap which is formed when the semiconductor element and the substrate are adhered to each other using an adhesive. The cooling medium comprises a liquid metal, metal-coated globules, or a liquid metal and metal-coated globules. The semiconductor device is configured to suppress the temperature increase by means of the cooling media transmitting heat generated by the semiconductor element to the outside.
Inventors:
TANAKA TAKAYUKI (JP)
Application Number:
PCT/JP2022/011599
Publication Date:
September 29, 2022
Filing Date:
March 15, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
| WO2017006391A1 | 2017-01-12 |
Foreign References:
| JPH11111897A | 1999-04-23 | |||
| JP2010129827A | 2010-06-10 | |||
| US20090149021A1 | 2009-06-11 | |||
| JP2004356436A | 2004-12-16 |
Attorney, Agent or Firm:
MATSUO Kenichiro (JP)
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