Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, PREPARATION METHOD OF CURED PRODUCT, HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/202486
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a negative photosensitive resin composition, from which high aspect ratio pattern processability, good storage stability, and curability are obtained; and a cured product having excellent mechanical properties and heat resistance. A negative photosensitive resin composition contains (A) a polymer compound, (B) a cation-polymerizable compound, (C) a cation polymerization initiator, and (D) a solvent, wherein the (A) component contains at least one compound selected from the group consisting of polyamide, polyimide, polybenzoxazole, a precursor thereof, and a copolymer thereof, and when all carboxylic acid residues included in the (A) component are A mol, all diamine residues are B mol, and all monoamine residues are C mol, 0.6A≦B+0.5C≦0.98A and 0.05(B+C)≦C≦0.25(B+C) are satisfied.
Inventors:
AOSHIMA KENTA (JP)
KOYAMA YUTARO (JP)
MATSUMURA KAZUYUKI (JP)
ARAKI HITOSHI (JP)
KOYAMA YUTARO (JP)
MATSUMURA KAZUYUKI (JP)
ARAKI HITOSHI (JP)
Application Number:
PCT/JP2022/011591
Publication Date:
September 29, 2022
Filing Date:
March 15, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G59/68; C08G69/00; C08G73/06; G03F7/004; G03F7/037; H05K3/28
Domestic Patent References:
| WO2020059382A1 | 2020-03-26 | |||
| WO2021006181A1 | 2021-01-14 | |||
| WO2008007764A1 | 2008-01-17 |
Foreign References:
| JP2020166125A | 2020-10-08 | |||
| JP2010256881A | 2010-11-11 | |||
| JP2006309202A | 2006-11-09 | |||
| JP2019038964A | 2019-03-14 |
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