Title:
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/235597
Kind Code:
A1
Abstract:
Disclosed is a semiconductor device manufacturing method comprising: a step for machining a semiconductor member that is temporarily fixed to a support substrate; and a step for separating the semiconductor member from the support substrate by applying light, from the rear surface side of the support substrate, to a laminated body for temporary fixing. Light is sequentially applied to a plurality of irradiated regions, and each of the irradiated regions includes a part of the rear surface. When viewed in a direction perpendicular to the rear surface, the irradiated regions adjacent to each other partially overlap with each other, and a region in which the plurality of irradiated regions are combined with one another includes the entirety of the rear surface.
Inventors:
AKASU YUTA (JP)
MIYAZAWA EMI (JP)
KAWAMORI TAKASHI (JP)
SOBUE SHOGO (JP)
OOYAMA YASUYUKI (JP)
MIYAZAWA EMI (JP)
KAWAMORI TAKASHI (JP)
SOBUE SHOGO (JP)
OOYAMA YASUYUKI (JP)
Application Number:
PCT/JP2020/019963
Publication Date:
November 26, 2020
Filing Date:
May 20, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J201/00; C09J7/35; H01L21/301; H01L21/304
Foreign References:
| JP2016048729A | 2016-04-07 | |||
| JP2013534721A | 2013-09-05 | |||
| JP2012126803A | 2012-07-05 | |||
| JP2016138182A | 2016-08-04 | |||
| JP2013033814A | 2013-02-14 |
Other References:
See also references of EP 3974491A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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