Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/049138
Kind Code:
A1
Abstract:
This semiconductor device 10 comprises: a base member 12, a detection element 14 that is provided on the base member 12 and comprises a first surface 14a upon which a detection unit 14d is disposed, and a resin package 18 that is provided on the base member 12 and comprises an exposure hole 18a that exposes the detection unit 14d of the detection element 14 to the outside. At least a portion of the outer peripheral edge 14f of the first surface 14a of the detection element 14 is exposed inside the exposure hole 18a, and the resin package 18 has a recess 18e following the portion of the outer peripheral edge 14f that is exposed inside the exposure hole 18a.
Inventors:
YOSHIDA YOSHIHIRO (JP)
YOSHIDA KOICHI (JP)
YOSHIDA KOICHI (JP)
Application Number:
PCT/JP2020/026094
Publication Date:
March 18, 2021
Filing Date:
July 02, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01L9/00; G01L19/14; H01L21/56; H01L23/02; H01L23/08
Foreign References:
| JP2008211124A | 2008-09-11 | |||
| JP2012083124A | 2012-04-26 | |||
| JP2010230655A | 2010-10-14 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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