Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/166512
Kind Code:
A1
Abstract:
A semiconductor device according to the present invention is provided with: a first lead; a semiconductor element; a sealing resin section; a first plated layer; and a second plated layer. The first lead has a first principal surface and a first rear surface that are oriented in opposite directions in the thickness direction and has a first recessed section that is recessed from the first rear surface towards the first principal surface side. The semiconductor element is mounted on the first principal surface. The sealing resin section covers the semiconductor element. The first plated layer is formed so as to be in contact with the first principal surface and the first rear surface. The first recessed section is exposed from the sealing resin section. The first plated layer has a first section covering the first rear surface. The second plated layer is formed so as to be in contact with the first recessed section and the first section.
Inventors:
FUKUI SUSUMU (JP)
TAKAHASHI TAKAKI (JP)
DEGUCHI KANAKO (JP)
NASU KENTARO (JP)
TAKAHASHI TAKAKI (JP)
DEGUCHI KANAKO (JP)
NASU KENTARO (JP)
Application Number:
PCT/JP2020/004860
Publication Date:
August 20, 2020
Filing Date:
February 07, 2020
Export Citation:
Assignee:
ASE JAPAN CO LTD (JP)
ROHM CO LTD (JP)
ROHM CO LTD (JP)
International Classes:
H01L21/301; H01L23/12; H01L23/48; H01L23/50; H01L29/78
Foreign References:
| JP2017201675A | 2017-11-09 | |||
| JP2005038927A | 2005-02-10 | |||
| JP2014007287A | 2014-01-16 | |||
| JP2008112961A | 2008-05-15 | |||
| JP2018190882A | 2018-11-29 | |||
| JP2012109529A | 2012-06-07 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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