Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/195885
Kind Code:
A1
Abstract:
The purpose of the present invention is to simplify the construction of a pad in a semiconductor device provided with a pad. The semiconductor device is provided with a pad. The pad of the semiconductor device is constructed of a hybrid pad layer disposed adjacent to an interlayer dielectric film formed on a semiconductor substrate. The hybrid pad layer of which the pad is constructed is a pad layer in which a metal region and a bulging region are disposed in the same layer. The bulging region disposed in the hybrid pad layer is a region in which a deformed portion created by deformation of the metal region bulges.
Inventors:
HARADA TSUBASA (JP)
HIROOKA SHOICHI (JP)
HIROOKA SHOICHI (JP)
Application Number:
PCT/JP2020/010764
Publication Date:
October 01, 2020
Filing Date:
March 12, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/60; H01L21/3205; H01L21/768; H01L23/522; H01L27/146
Domestic Patent References:
| WO2006046302A1 | 2006-05-04 |
Foreign References:
| JPH10233507A | 1998-09-02 | |||
| JPH11135536A | 1999-05-21 | |||
| JP2008258445A | 2008-10-23 |
Attorney, Agent or Firm:
MATSUO Kenichiro (JP)
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