Title:
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/031513
Kind Code:
A1
Abstract:
A semiconductor device which comprises: a substrate; a semiconductor element which is arranged on the substrate; a wire which electrically connects the substrate and the semiconductor element with each other; a first sealing layer which seals the space below the tip of the wire; and a second sealing layer which is provided on top of the first sealing layer, with the bonding wire being interposed therebetween. This semiconductor device is configured such that: the first sealing layer is composed of a cured film of a liquid sealing material; and the second sealing layer is composed of a dried coating film of an insulating resin coating material.
Inventors:
SATOH EIICHI (JP)
TAKEMORI DAICHI (JP)
SATO MIZUKI (JP)
TOGAWA MITSUO (JP)
YAMADA KAZUHIKO (JP)
SEKI KOHEI (JP)
TAKEMORI DAICHI (JP)
SATO MIZUKI (JP)
TOGAWA MITSUO (JP)
YAMADA KAZUHIKO (JP)
SEKI KOHEI (JP)
Application Number:
PCT/JP2018/029634
Publication Date:
February 14, 2019
Filing Date:
August 07, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L23/29; C08G59/20; C08J7/04; C08L63/00; C08L79/08; H01L21/56; H01L23/00; H01L23/31
Domestic Patent References:
| WO2014128899A1 | 2014-08-28 |
Foreign References:
| JPH10261741A | 1998-09-29 | |||
| JPH0574831A | 1993-03-26 | |||
| JPH10120878A | 1998-05-12 | |||
| JP2011035334A | 2011-02-17 | |||
| JP2013166925A | 2013-08-29 | |||
| JPH02289646A | 1990-11-29 | |||
| JP6292334B1 | 2018-03-14 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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