Title:
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/244953
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a semiconductor device which has excellent heat dissipation properties and excellent electromagnetic wave suppressing effect. In order to solve the above-described problem, a semiconductor device 1 according to the present invention is characterized by being provided with: a semiconductor element 30; a conductive cooling member 40 which is provided above the semiconductor element 30; and a conductive heat transfer member 10 which is provided between the semiconductor element 30 and the cooling member 40, and which contains a cured product of a resin. The semiconductor device 1 is also characterized in that: a ground 60 in the substrate 50 is connected; and the cooling member 40 and the ground 60 are electrically connected to each other.
Inventors:
KUBO YUSUKE (JP)
BOLOTOV SERGEY (JP)
BOLOTOV SERGEY (JP)
Application Number:
PCT/JP2019/024366
Publication Date:
December 26, 2019
Filing Date:
June 19, 2019
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L23/29; H01L23/00; H05K7/20; H05K9/00
Foreign References:
| JP2002026178A | 2002-01-25 | |||
| JP2008166641A | 2008-07-17 | |||
| JP2017057246A | 2017-03-23 | |||
| JP2018073897A | 2018-05-10 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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