Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND ELECTRONIC MACHINE
Document Type and Number:
WIPO Patent Application WO/2021/029183
Kind Code:
A1
Abstract:
Provided is a semiconductor device comprising: a semiconductor layer that includes a channel layer; a contact region which is provided at a prescribed size along a thickness direction of the semiconductor layer, and which has a higher concentration of impurities than the concentration of impurities in the surrounding semiconductor layer; a gate electrode which faces the channel layer and which is provided on the semiconductor layer so as to be separated from the contact region; and an electrode which is in contact with the semiconductor layer as well as electrically connected to the channel layer via the contact region, and extends past the contact region toward at least a gate electrode side.
Inventors:
TAKEUCHI KATSUHIKO (JP)
YANAGITA MASASHI (JP)
YANAGITA MASASHI (JP)
Application Number:
PCT/JP2020/027822
Publication Date:
February 18, 2021
Filing Date:
July 17, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/28; H01L21/336; H01L21/338; H01L29/41; H01L29/417; H01L29/778; H01L29/78; H01L29/812
Domestic Patent References:
| WO2010082272A1 | 2010-07-22 |
Foreign References:
| JP2010278137A | 2010-12-09 | |||
| JP2013038239A | 2013-02-21 | |||
| JP2010118556A | 2010-05-27 | |||
| JP2009302166A | 2009-12-24 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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