Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND ELECTRONIC MACHINE
Document Type and Number:
WIPO Patent Application WO/2022/163196
Kind Code:
A1
Abstract:
A semiconductor device according to an embodiment of the present disclosure comprises a low-resistance-material unit and a low-heat-resistance-material unit. The low-resistance-material unit comprises: a barrier layer; a channel layer; and a low-resistance material that abuts a source electrode or a drain electrode and has lower resistance than the channel layer. The low-heat-resistance-material unit comprises a low-heat-resistance material that abuts the channel layer and a buffer layer and has a lower heat resistance than the channel layer.
Inventors:
TAKEUCHI KATSUHIKO (JP)
Application Number:
PCT/JP2021/046629
Publication Date:
August 04, 2022
Filing Date:
December 16, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L29/778; H01L21/28; H01L21/338; H01L29/41; H01L29/417; H01L29/812
Foreign References:
| JP2009004398A | 2009-01-08 | |||
| JP2005109133A | 2005-04-21 | |||
| JP2019208068A | 2019-12-05 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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