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Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND SEMICONDUCTOR MODULE MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/243464
Kind Code:
A1
Abstract:
This semiconductor module comprises a plurality of semiconductor devices and a coupling part. The plurality of semiconductor devices each comprise: a semiconductor element; a sealing part that covers the semiconductor element; and a signal terminal that projects from the sealing part in the thickness direction of the sealing part and that is electrically connected to the semiconductor element. The coupling part couples the plurality of semiconductor devices with each other. The plurality of semiconductor devices include a first device and a second device adjacent with each other in a first direction orthogonal to the thickness direction. The coupling part includes a first connection section that is located between the first device and the second device in the first direction and that couples the first device and the second device with each other.

Inventors:
TANIKAWA KOHEI (JP)
YASUNISHI TOMOHIRO (JP)
FUJIMURA TOMOKI (JP)
IKEDA DAIKI (JP)
Application Number:
PCT/JP2023/020834
Publication Date:
December 21, 2023
Filing Date:
June 05, 2023
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L21/60; H01L23/40; H01L25/18
Domestic Patent References:
WO2021033600A12021-02-25
WO2015008333A12015-01-22
WO2020153190A12020-07-30
Foreign References:
JP2012190833A2012-10-04
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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