Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2023/162722
Kind Code:
A1
Abstract:
A semiconductor device according to the present invention comprises: a first semiconductor element that has a first gate electrode; a second semiconductor element that has a second gate electrode; a sealing resin; a first signal terminal that has a third center; and first signal wiring. The length of the straight line connecting a first center of the first gate electrode and the third center is designated as first linear length L1. The length of the straight line connecting a second center of the second gate electrode and the third center is designated as second linear length L2. The length of the route from the first center to the third center via the first signal wiring is designated as first route length R1. The length of the route from the second center to the third center via the first signal wiring is designated as second route length R2. In the semiconductor device, the relationship R2/R1 is closer to 1 than the relationship L2/L1.
Inventors:
FUJI KAZUNORI (JP)
Application Number:
PCT/JP2023/004560
Publication Date:
August 31, 2023
Filing Date:
February 10, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/18; H01L25/04
Foreign References:
| JP2021141219A | 2021-09-16 | |||
| JP2010027691A | 2010-02-04 | |||
| JP2003243594A | 2003-08-29 | |||
| JP2021082714A | 2021-05-27 | |||
| JP2016100520A | 2016-05-30 | |||
| JP2021093484A | 2021-06-17 | |||
| JP2018085452A | 2018-05-31 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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