Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/102196
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a semiconductor device that can suppress device size shrinkage, reduction in series resistance, and leak current.
The present invention ventures to insert into the device structure a layer that generates a difference in electric potential that was unnecessary conventionally for device operation. Even when a semiconductor with a small band gap is exposed on a mesa side surface, this difference in electric potential provides a function that can suppress the amount of drop in electric potential in that part and reduce leak current that is inconvenient for device operation. As a result, obtaining these effects is common to heterostructure bipolar transistors, photodiodes, electroabsorption optical modulators, and other devices. Furthermore, in photodiodes, leak current is relaxed; therefore the device size can be reduced. Not only is operating speed improved by reducing series resistance, but also the advantage of being able to dispose devices in a high density array form arises.
Inventors:
ISHIBASHI TADAO (JP)
ANDO SEIGO (JP)
MURAMOTO YOSHIFUMI (JP)
YOSHIMATSU TOSHIHIDE (JP)
YOKOYAMA HARUKI (JP)
ANDO SEIGO (JP)
MURAMOTO YOSHIFUMI (JP)
YOSHIMATSU TOSHIHIDE (JP)
YOKOYAMA HARUKI (JP)
Application Number:
PCT/JP2012/051178
Publication Date:
August 02, 2012
Filing Date:
January 20, 2012
Export Citation:
Assignee:
NTT ELECTRONICS CORP (JP)
NIPPON TELEGRAPH & TELEPHONE (JP)
ISHIBASHI TADAO (JP)
ANDO SEIGO (JP)
MURAMOTO YOSHIFUMI (JP)
YOSHIMATSU TOSHIHIDE (JP)
YOKOYAMA HARUKI (JP)
NIPPON TELEGRAPH & TELEPHONE (JP)
ISHIBASHI TADAO (JP)
ANDO SEIGO (JP)
MURAMOTO YOSHIFUMI (JP)
YOSHIMATSU TOSHIHIDE (JP)
YOKOYAMA HARUKI (JP)
International Classes:
H01L21/331; G02F1/017; H01L29/737; H01L31/10
Foreign References:
JPS60242671A | 1985-12-02 | |||
JPH05243252A | 1993-09-21 | |||
JPH07254612A | 1995-10-03 |
Other References:
See also references of EP 2669934A4
Attorney, Agent or Firm:
OKADA, Kenji et al. (JP)
Kenji Okada (JP)
Kenji Okada (JP)
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Claims: