Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/121968
Kind Code:
A1
Abstract:
Provided is a semiconductor device in which the size of a withstand voltage structure part can be easily reduced. Provided is a semiconductor device provided with a withstand voltage structure part and an active region formed on the obverse surface side of a semiconductor substrate, the withstand voltage structure part being provided with: a guard ring provided on the obverse surface side of the semiconductor substrate so as to surround the active region; a first field plate provided on the obverse surface side of the guard ring; an electrode part provided on the obverse surface side of the first field plate; a second field plate provided between the first field plate and the electrode part; and a conducting connection part for electrically connecting the first field plate, the electrode part, the second field plate, and the guard ring to each other.
Inventors:
KATOU YOSHIHARU (JP)
TAKAHASHI HIDENORI (JP)
TAKAHASHI HIDENORI (JP)
Application Number:
PCT/JP2016/052784
Publication Date:
August 04, 2016
Filing Date:
January 29, 2016
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L29/06; H01L29/739; H01L29/78
Domestic Patent References:
| WO2014125626A1 | 2014-08-21 |
Foreign References:
| JP2009117715A | 2009-05-28 |
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
Ryuka international patent business corporation (JP)
Ryuka international patent business corporation (JP)
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