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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/187183
Kind Code:
A1
Abstract:
This semiconductor device comprises a semiconductor element, an element conductor having on the upper section thereof an element placement surface for placing the semiconductor element, a connection conductor disposed to be spaced from the element conductor and having on the upper section thereof a connection surface, a connection line connecting the semiconductor element to the connection surface of the connection conductor, and a seal resin sealing the semiconductor element, the element conductor, the connection conductor, and the connection line. Among opposing-side surfaces of the element conductor and the connection conductor which are disposed face-to-face, at least one is provided with a parasitic capacitance reducing structure.

Inventors:
TAKAO KATSUHIRO (JP)
Application Number:
PCT/JP2018/026364
Publication Date:
October 03, 2019
Filing Date:
July 12, 2018
Export Citation:
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Assignee:
AOI ELECTRONICS CO LTD (JP)
International Classes:
H01L23/48; H01L23/12; H01L23/50
Foreign References:
JP2013183055A2013-09-12
JP2008103550A2008-05-01
JP2012235172A2012-11-29
JP2005217452A2005-08-11
JPH0497549A1992-03-30
JPH11330313A1999-11-30
JP2007074066A2007-03-22
Attorney, Agent or Firm:
NAGAI, Fuyuki et al. (JP)
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