Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/184053
Kind Code:
A1
Abstract:
This semiconductor device comprises: a semiconductor element (40) that has a first main electrode (41C) and a second main electrode (41E) through which a main current flows between the first main electrode and the second main electrode; a sealing resin body (30) that seals the semiconductor element; and first main terminals (71C) and second main terminals (71E) that are a plurality of main terminals (71) electrically connected to the corresponding main electrodes inside the sealing resin body and extending outward from the sealing resin body. The main terminals protrude from one surface (302) of the sealing resin body, and the first main terminals and the second main terminals are alternately arranged such that side surfaces (710C, 710E) face each other in a direction orthogonal to the thickness direction of the semiconductor element. The width of a protrusion portion of the main terminal in one direction is greater in external connection parts (712C, 712E) to which other members are connected than in boundary parts (713C, 713E) with the sealing resin body.
Inventors:
MIWA RYOTA (JP)
NAGASE TAKUO (JP)
ISHINO HIROSHI (JP)
NAGASE TAKUO (JP)
ISHINO HIROSHI (JP)
Application Number:
PCT/JP2020/005573
Publication Date:
September 17, 2020
Filing Date:
February 13, 2020
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
| WO2020021843A1 | 2020-01-30 | |||
| WO2020021881A1 | 2020-01-30 |
Foreign References:
| JP2018067657A | 2018-04-26 | |||
| JP2014127583A | 2014-07-07 | |||
| JP2015208115A | 2015-11-19 | |||
| JP2011199039A | 2011-10-06 | |||
| JP2014050118A | 2014-03-17 | |||
| US8508025B2 | 2013-08-13 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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