Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/225006
Kind Code:
A1
Abstract:
A semiconductor device is provided with: a semiconductor element that has a first electrode and a second electrode on a first surface and a third electrode on a second surface, electrical conduction between the second electrode and the third electrode being controlled by a voltage applied to the first electrode; an electroconductive first lead electrically connected to the first electrode, the first lead extending to a position farther on the outside than the peripheral edge part of the first surface; and an electroconductive second lead electrically connected to the second electrode, the second lead extending to a position farther on the outside than the peripheral edge part of the first surface. At least one of the sides of the peripheral edge part of the first surface does not face the first lead or the second lead, and a groove is formed in a portion of the first lead and the second lead facing the peripheral edge part of the first surface.
Inventors:
TAKAO KATSUHIRO (JP)
KUROHA ATSUSHI (JP)
KUROHA ATSUSHI (JP)
Application Number:
PCT/JP2020/027300
Publication Date:
November 11, 2021
Filing Date:
July 13, 2020
Export Citation:
Assignee:
AOI ELECTRONICS CO LTD (JP)
International Classes:
H01L23/48; H01L25/07; H01L25/18
Foreign References:
| JP2006179735A | 2006-07-06 | |||
| JP2010232365A | 2010-10-14 | |||
| JP2013149760A | 2013-08-01 | |||
| JP2019153752A | 2019-09-12 |
Attorney, Agent or Firm:
SUDO, Akinobu et al. (JP)
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