Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/018999
Kind Code:
A1
Abstract:
This semiconductor device comprises a semiconductor element (30) having a first main electrode (31) and a second main electrode (32) that is formed on the surface opposite from the first main electrode in the plate thickness direction. The semiconductor device comprises a lead frame (5) having a base frame (10) that includes a first main terminal (11) and a second main terminal (12), and a cross-linked frame (50) that is provided on the side opposite from the base frame in the plate thickness direction and that includes a cross-linked member (52) for a main electrode. The semiconductor device comprises: projections (4, 7) that project in a direction for which the distance between frames, which is the distance between the base frame and the cross-linked frame in the plate thickness direction, is short; and junctions (24, 27) that join the base frame and the cross-linked frame so as to include the projections. It is therefore possible to obtain a semiconductor device in which the lead frame is stably joined.
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| JPS60160627 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE |
Inventors:
AZUMA HAYATO (JP)
SUZUKI KOUSUKE (JP)
SANADA YUUKI (JP)
SUZUKI KOUSUKE (JP)
SANADA YUUKI (JP)
Application Number:
PCT/JP2021/022463
Publication Date:
January 27, 2022
Filing Date:
June 14, 2021
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
| WO2012169044A1 | 2012-12-13 | |||
| WO2012143964A1 | 2012-10-26 | |||
| WO2016136457A1 | 2016-09-01 |
Foreign References:
| JP2003124438A | 2003-04-25 |
Attorney, Agent or Firm:
YAHAGI Kazuyuki et al. (JP)
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