Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/264833
Kind Code:
A1
Abstract:
This semiconductor device comprises: first and second conductive plates that are spaced apart from each other in a direction x; a third conductive plate that faces the first and second conductive plates in a direction z; a first semiconductor element that is disposed between the first conductive plate and the third conductive plate; a second semiconductor element that is disposed between the second conductive plate and the third conductive plate; a positive-electrode input terminal that is electrically connected to the first conductive plate; a negative-electrode input terminal that is electrically connected to the second conductive plate; an output terminal that is electrically connected to the third conductive plate; and an encapsulation resin that covers at least the first and second semiconductor elements.
Inventors:
WU XIAOPENG (JP)
Application Number:
PCT/JP2022/022583
Publication Date:
December 22, 2022
Filing Date:
June 03, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/29; H01L23/48; H01L25/07; H01L25/18; H01L29/12; H01L29/739; H01L29/78
Domestic Patent References:
| WO2020241346A1 | 2020-12-03 |
Foreign References:
| JP2013038309A | 2013-02-21 | |||
| JP2011181879A | 2011-09-15 | |||
| JP2020170825A | 2020-10-15 | |||
| JP2018207044A | 2018-12-27 | |||
| JP2019021864A | 2019-02-07 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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