Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/248718
Kind Code:
A1
Abstract:
A semiconductor device according to the present invention comprises: a plurality of transistors which are electrically connected in parallel with each other, and each of which comprises a first pad; and a conductive member. The first pad is a source pad or an emitter pad; and the first pad has a first connection region, and a second connection region and a third connection region, between which the first connection region is sandwiched. This semiconductor device comprises: a first connection member which connects the first connection region and the conductive member to each other; a second connection member which connects the second connection regions of two transistors among the plurality of transistors; and a third connection member which connects the third connection regions of the two transistors among the plurality of transistors.
Inventors:
KANEDA TATSUSHI (JP)
Application Number:
PCT/JP2023/019756
Publication Date:
December 28, 2023
Filing Date:
May 26, 2023
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L25/07; H01L23/48; H01L25/18; H02M7/48
Foreign References:
| JP2022070377A | 2022-05-13 | |||
| JP2001035983A | 2001-02-09 | |||
| JP2013012560A | 2013-01-17 | |||
| JP2016184667A | 2016-10-20 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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