Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/057847
Kind Code:
A1
Abstract:
A semiconductor device equipped with a first switching element and a first main connection member. The first switching element has a first electrode, which has been disposed on one thickness-direction side and in which a main electric current flows. The first main connection member is connected to the first electrode. The semiconductor device is further equipped with a first minor connection member connected to the first main connection member and with a second minor connection member. The first main connection member comprises a first main metal as a main component. The first minor connection member comprises a first minor metal as a main component. The second minor connection member comprises a second minor metal as a main component. The first minor metal and the second minor metal differ in thermoelectric power from each other.
Inventors:
UMEGAMI HIROKATSU (JP)
Application Number:
PCT/JP2023/030264
Publication Date:
March 21, 2024
Filing Date:
August 23, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L21/60; H01L25/18
Domestic Patent References:
| WO2020255663A1 | 2020-12-24 | |||
| WO2022080122A1 | 2022-04-21 |
Foreign References:
| JP2009293986A | 2009-12-17 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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