Title:
SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2022/080248
Kind Code:
A1
Abstract:
The present invention measures the strength of adhesion for a connection unit adhered to a semiconductor element. The semiconductor element has a semiconductor substrate and an adhesive pad. Disposed adjacent to this semiconductor substrate is a wiring region that has an element formed therein and has wiring that transmits the element signals. The adhesive pad is disposed in the wiring region adjacent to a semiconductor substrate-removed region which is a region from which the semiconductor substrate has been removed, said adhesive pad being connected to the wiring and having the connection unit for connecting to the outside adhered thereto. This semiconductor substrate-removed region includes a region for measuring the adhesion strength between the adhesive pad and the connection unit.
Inventors:
AKIYAMA KENTARO (JP)
Application Number:
PCT/JP2021/037309
Publication Date:
April 21, 2022
Filing Date:
October 08, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/60; H01L21/301; H01L21/3205; H01L21/66; H01L21/768; H01L23/522; H01L27/146
Domestic Patent References:
| WO2016117124A1 | 2016-07-28 |
Foreign References:
| JP2010109137A | 2010-05-13 | |||
| US20100248399A1 | 2010-09-30 | |||
| US20190333947A1 | 2019-10-31 | |||
| JP2018170471A | 2018-11-01 | |||
| JP2012033878A | 2012-02-16 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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